Thread

1. HarHarVeryFunny · 1789937583 · focus · HN ↗

   On a related note, I was reading yesterday that apparently the real bottleneck for Chinese production of AI accelerators is HBM production, not processors or ASML equipment.

   The lack of ASML EUV machines certainly hurts, and pushing DUV so hard results in abysmal yields of good chips, but you can compensate by running more wafers or making smaller chips, and the net result is that Huawei's Ascend production volume is limited by CXMT's HBM capacity not processor dies.

   The problem is that HBM manufacture requires many steps (die thinning, via drilling, plating, alignment) where the equipment used by everyone else (Samsung, SK Hynix, Micron) is also blocked by sanctions, so the Chinese are having to develop all of this themselves too, which they have, but yields are currently low, even when using shorter HBM stacks.

   1. jacquesm · 1789951954 · focus · HN ↗

      The only thing the West is achieving here is that sooner or later China will be able to compete on their own terms rather than ours. It may buy some time but the end result is very predictable.

      1. SadErn · 1789962230 · focus · HN ↗

         When China eventually catches up on conventional lithography, the goalposts will shift to silicon photonics and optical logic, a transition DARPA laid the publicly visible groundwork for decades ago through programs like POEM and PIPES while keeping the mature implementations strictly classified until needed.

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