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TSMC revealing details about next gen A14 node

129 points · 56 comments · osnium123

  1. moeadham · · focus · HN ↗
    I can’t believe we’re talking Angstroms already.
    1. FlowingRiver · · focus · HN ↗
      I did find it funny recently when Huawei when talking about its folded logic say the Vertical Bonding Pitch's are every 15,000 angstroms. It is a very fancy way of saying an interconnect every 1.5 microns.
      1. AnotherGoodName · · focus · HN ↗
        They should just say every 7 silicon atoms at that point.
        1. fc417fc802 · · focus · HN ↗
          7500 surely? But yeah at this point I feel like the diameter of a silicon atom would make for a better unit of measure.
          1. AnotherGoodName · · focus · HN ↗
            Oh right i was thinking the feature size (about that many namometers not microns)
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